Cemented carbide composite for a downhole tool

ABSTRACT

A carbide composite for a downhole tool may be formed by depositing a first layer on a substrate, and a second layer at least partially adjacent to the first layer. The first and second layers may each include carbides, metal binders, organic binders, or a combination thereof. The first and second carbide layers may have a different particle size, particle shape, carbide concentration, metal binder concentration, or organic binder concentration from one another.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of U.S. ProvisionalApplication No. 61/808,355, filed on Apr. 4, 2013, entitled, “CEMENTEDCARBIDE COMPOSITE FOR A DOWNHOLE TOOL” to Madapusi K. Keshavan, theentire contents of which are fully incorporated herein by reference.

BACKGROUND

Cemented carbide composites for downhole tools are often produced byusing carbide dies and one or more carbide powders and binders. Theprocess typically includes the design and fabrication of a die, followedby pressing a carbide powder in the die to provide an unsintered or“green” substrate. If additional features are desired in the cementedcarbide composite that cannot be achieved by pressing or otherwiseconsolidating the powder, one or more machining and/or shaping processesare employed. For example, pressing the carbide powder may only providelimited features to the green substrate. Accordingly, one or moreshaping processes may be utilized to provide additional features, e.g.,undercuts and holes, to the green substrate. This conventionalmulti-step, powder metallurgy process for fabricating green carbidecomposites may be costly, complex, and time-consuming.

SUMMARY

This summary is provided to introduce a selection of concepts that arefurther described below in the detailed description. This summary is notintended to identify key or essential features of the claimed subjectmatter, nor is it intended to be used as an aid in limiting the scope ofthe claimed subject matter.

A method for fabricating a carbide composite for a downhole tool isdisclosed. The method may include depositing a first layer on asubstrate and depositing a second layer at least partially adjacent thefirst layer. The first and second layers may each include carbides,metal binders, organic binders, or a combination thereof. The first andsecond layers may have a different particle size, particle shape,carbide concentration, metal binder concentration, or organic binderconcentration from one another. The first and second layers may be boundto one another to form the carbide composite.

Another method for fabricating a carbide composite for a downhole toolis disclosed. The method may include depositing a carbide layer on asubstrate. The carbide layer may include tungsten carbide and cobalt. Asecond layer may be deposited at least partially on the carbide layer.The second layer may include carbides, metal binders, organic binders,diamond particles, or a combination thereof. The carbide layer and thesecond layer may have a different particle size, particle shape, carbideconcentration, metal binder concentration, diamond particleconcentration, or binder concentration from one another. The method mayfurther include binding the carbide layer and the second layer to formthe carbide composite. A polycrystalline diamond insert may be formed bysintering the carbide composite.

A carbide composite for a downhole tool is disclosed. The carbidecomposite may include a carbide layer bound to a second layer. Thecarbide layer may include tungsten carbide and cobalt. The second layermay be at least partially adjacent and bound to the carbide layer. Thesecond layer may include carbides, metal binders, organic binders, or acombination thereof. The carbide layer and second layer may have adifferent particle size, particle shape, carbide concentration, metalbinder concentration, or organic binder concentration from one another.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the disclosure are described with reference to thefollowing figures. The same numbers are used throughout the figures toreference like features and components.

FIG. 1 depicts a schematic system for fabricating a carbide compositefor a downhole tool via 3D printing, according to one or moreembodiments disclosed.

FIG. 2 depicts an illustrative CAD assembly for providing a digitaldesign for the carbide composite in three dimensions, according to oneor more embodiments disclosed.

FIG. 3 depicts an illustrative process for forming and binding theslices of the carbide composite, according to one or more embodimentsdisclosed.

FIG. 4 depicts a side view of an illustrative downhole tool includinginserts fabricated via 3D printing, according to one or more embodimentsdisclosed.

DETAILED DESCRIPTION

A carbide composite fabricated via an additive manufacturing (AM)process or 3D printing may include at least two distinct layers, eachmade of or including one or more carbide compositions. The number ofdistinct layers may vary from a low of about 2, about 3, about 4, about5, about 10, or about 15 to a high of about 20, about 30, about 50,about 150, about 200, about 250, about 300, about 400, about 500, ormore.

Each layer may be or include one or more carbide compositions having oneor more carbides, one or more metal binders, one or more organicbinders, one or more diamond particles, or any combination thereof. Bycontrolling the particle size, particle shape, carbide concentration,metal binder concentration, diamond particle concentration, and/ororganic binder concentration of the carbide composition, each layer maybe the same or different. For example, each layer may have the samecarbide concentration, metal binder concentration, organic binderconcentration, and/or diamond particle concentration but have differentparticle sizes. Similarly, each layer may also have the same carbideconcentration, metal binder concentration, organic binder concentration,and/or diamond particle concentration but have different particleshapes. The relative concentrations of the carbide, metal binder andorganic binder may be controlled to provide a layer that is distinct(i.e., different) from another. Other iterations and permutations of theforegoing parameters are envisioned to provide two or more distinctlayers.

Suitable carbides may be or include refractory carbides or carbides ofone or more transition metals from Groups IV to VI of the PeriodicTable. Illustrative transition metals may include, but are not limitedto, titanium, vanadium, chromium, zirconium, niobium, molybdenum,hafnium, tantalum, tungsten, or any mixture thereof. For example, thecarbides may include tungsten carbide, vanadium carbide, titaniumcarbide, chromium carbide, zirconium carbide, niobium carbide,molybdenum carbide, hafnium carbide, tantalum carbide, or any mixturesor alloys thereof.

Suitable metal binders may include any one or more transition metalsincluding, but not limited to, magnesium, ruthenium, osmium, iron,cobalt, nickel, copper, molybdenum, tantalum, tungsten, rhenium, or anymixture or alloy thereof. The metal binders may also include any alkalimetals including, but not limited to, lithium, sodium, potassium,rubidium, cesium, or any mixture or alloy thereof.

Suitable organic binders may be or include one or more waxes or resinsthat are insoluble, or at least substantially insoluble, in water. Waxesmay include, for example, animal waxes, vegetable waxes, mineral waxes,synthetic waxes, or any combination thereof. Illustrative animal waxesmay include, but are not limited to, bees wax, spermaceti, lanolin,shellac wax, or any combination thereof. Illustrative vegetable waxesmay include, but are not limited to, carnauba, candelilla, or anycombination thereof. Illustrative mineral waxes may include, but are notlimited to, ceresin and petroleum waxes (e.g., paraffin wax).Illustrative synthetic waxes may include, but are not limited to,polyolefins (e.g., polyethylene), polyol ether-esters, chlorinatednaphthalenes, hydrocarbon waxes, or any combination thereof. The organicbinder may also include waxes that are insoluble in organic solvents.Illustrative waxes that are insoluble in organic solvents may include,but are not limited to, polyglycol, polyethylene glycol,hydroxyethylcellulose, tapioca starch, carboxymethylcellulose, or anycombination thereof. Illustrative organic binders may also include, butare not limited to, starches, and cellulose, or any combination thereof.The organic binders may also include, but are not limited to, microwaxesor microcrystalline waxes. Microwaxes may include waxes produced byde-oiling petrolatum, which may contain a higher percentage ofisoparaffinic and naphthenic hydrocarbons as compared to paraffin waxes.

Suitable diamond particles may be naturally occurring and/orsynthetically produced. The diamond particles may have a particle sizeor average grain size from a low of about 1 micron (μm), about 2 μm,about 3 μm, about 5 μm, or about 10 μm to a high of about 15 μm, about20 μm, about 30 μm, about 40 μm, about 50 μm, about 60 μm, about 70 μm,about 80 μm, about 90 μm, about 180 μm, or more. For example, thediamond particles may have a particle size or average grain size fromabout 1 μm to about 180 μm, about 5 μm to about 90 μm, about 10 μm toabout 80 μm, about 20 μm to about 70 μm, about 30 μm to about 60 μm, orabout 40 μm to about 50 μm.

FIG. 1 depicts a schematic system 100 for fabricating a carbidecomposite 180 for a downhole tool via 3D printing, according to one ormore embodiments. The system 100 may include a computer aided design(CAD) assembly 120 and a layering device 130. The CAD assembly 120 maybe or include any software of a computer aided device capable ofproviding a geometry or digital design 110 for the carbide composite 180in three dimensions. The digital design 110 may be used as a template orguide by the layering device 130 to fabricate the carbide composite 180,as further describe herein. The layering device 130 may be or includeany device capable of fabricating the carbide composite 180 using thedigital design 110 as a template or guide.

FIG. 2 depicts an illustrative CAD assembly 120 for providing thedigital design 110 for the carbide composite 180 in three dimensions,according to one or more embodiments. The CAD assembly 120 may includeone or more computers 210 that may include one or more centralprocessing units 215, one or more input devices or keyboards 230, andone or more monitors 250 on which a software application may beexecuted. The computer 210 may also include a memory 220 as well as oneor more input and output devices, for example a mouse 240, a microphone260, and a speaker 270. The mouse 240, the microphone 260, and thespeaker 270 may be used for, among other purposes, universal access andvoice recognition or commanding. The monitor 250 may be touch-sensitiveto operate as an input device as well as a display device.

The computer 210 may interface with one or more databases 277, supportcomputers or processors 275, other databases and/or other processors279, or the Internet via the network interface 280. It should beunderstood that the term “interface” refers to any possible externalinterfaces, wired or wireless. It should also be understood that thedatabase 277, processor 275, and/or other databases and/or otherprocessors 279 are not limited to interfacing with the computer 210using the network interface 280 and may interface with the computer 210in any means sufficient to create a communications path between thecomputer 210 and database 277, the processor 275, and/or other databasesand/or other processors 279. For example, the database 277 may interfacewith the computer 210 via a USB interface while the processor 275 mayinterface via some other high-speed data bus without using the networkinterface 280. The computer 210, the processor 275, and the otherprocessors 279 may be integrated into a multiprocessor distributedsystem.

It should be understood that even though the computer 210 is shown inFIG. 2 as a platform on which the methods discussed and described hereinmay be performed, the methods discussed and described herein may beperformed on any platform. For example, the many and varied embodimentsdiscussed and described herein may be used on any device that hascomputing capability. For example, the computing capability may includethe capability to access communications bus protocols such that the usermay interact with the many and varied computers 210, processors 275,and/or other databases and processors 279 that may be distributed orotherwise assembled. These devices may include, but are not limited to,supercomputers, arrayed server networks, arrayed memory networks,arrayed computer networks, distributed server networks, distributedmemory networks, distributed computer networks, desktop personalcomputers (PCs), tablet PCs, hand held PCs, laptops, devices sold underthe trademark names BLACKBERRY™, PALM™, SAMSUNG™, or APPLE™, cellularphones, hand held music players, or any other device or system havingcomputing capabilities.

Still referring to FIG. 2, programs or software may be stored in thememory 220, and the central processing unit 215 may work in concert withthe memory 220, the input device 230, and the output device 250 toperform tasks for the user. The memory 220 may include, but is notlimited to, any number and combination of memory devices that arecurrently available or may become available in the art. For example, thememory devices may include, but are not limited to, the database 277,other databases and/or processors 279, hard drives, disk drives, randomaccess memory, read memory, electronically erasable programmable readmemory, flash memory, thumb drive memory, and any other memory device.Those skilled in the art are familiar with the many variations that maybe employed using memory devices, and no limitations should be imposedon the embodiments herein due to memory device configurations and/oralgorithm prosecution techniques. The memory 220 may store an operatingsystem (OS) 245 and/or any software of the computer assisted devicecapable of providing the digital design 110. The operating system 245may facilitate, control, and execute the software using a centralprocessing unit 215. Any available operating system may be used in thismanner including WINDOWS™, LINUX™, Apple OS™, UNIX™, and the like. Thecentral processing unit 215 may execute the software from a userrequests or automatically.

Referring now FIGS. 1 and 2, the digital design 110 from the CADassembly 120 may include data defining one or more portions of thecarbide composite 180. For example, the digital design 110 may includedata defining an inner surface, an outer surface, and/or a volume of thecarbide composite 180 to be fabricated by the layering device 130. Thedigital design 110 may be communicated to the layering device 130 andmay provide a template or guide to fabricate the carbide composite 180.

The layering device 130 may be or include any device capable offabricating the carbide composite 180 from the digital design 110. Thelayering assembly 130 may fabricate the carbide composite 180 from thedigital design 110 of the CAD assembly 120 in one or more processes 170,175 as further described herein. Any suitable layering device 130 may beused. Suitable commercially available layering devices 130 include, butare not limited to, PROJET 1000™, PROJET 1500™, PROJET SD 3500™, PROJETHD 3500™, PROJET HD 3500PLUS™, PROJET 3500 HDMAX™, PROJET CP 3500™,PROJET CPX 3500™, PROJET CPX 3500PLUS™, PROJET 3500 CPXMAX™, PROJET7000™, PROJET 6000™, PROJET 5000™, PROJET DP 3500™, PROJET MP 3500™,ZPRINTER 150™, ZPRINTER 250™, ZPRINTER 350™, ZPRINTER 4501™, ZPRINTER650™, and/or ZPRINTER 850™, which are available from 3D Systems Corp.

A first process 170 in fabricating the carbide composite 180 from thedigital design 110 may be or include a digital process 170. The digitalprocess 170 may include dividing or partitioning the digital design 110from the CAD assembly 120 into two or more digital cross-sections (twoare shown 135, 136) using one or more horizontal planes 140. Thelayering device 130 may divide or partition the digital design 110 intoany number of cross-sections 135, 136 using any number of digitalhorizontal planes 140. For example, the number of cross-sections 135,136 may vary from a low of about 2, about 3, about 4, about 5, about 10,or about 15 to a high of about 20, about 30, about 50, about 150, about200, about 250, about 300, about 400, about 500, or more.

The digital cross-sections 135, 136 may provide a template or guide forforming one or more slices 150, 151 of the carbide composite 180 in asecond process 175 of the layering device 130. The digitalcross-sections 135, 136 may be two-dimensional or three-dimensional andmay include an outer cross-sectional line, an inner cross-sectionalline, a cross-sectional area, a volume, or any combination thereof. Theouter and inner cross-sectional lines of the digital cross-sections 135,136 may define an outer and inner surface of each of the slices 150,151, respectively, and the cross-sectional area may be or define avolume of each of the slices 150, 151. Each of the digitalcross-sections 135, 136 may define one or more portions or slices 150,151 of the carbide composite 180, respectively, and may be used as atemplate for building the slices 150, 151 of the carbide composite 180.For example, as shown in FIG. 1, a first digital cross-section 135 maydefine a first slice 150 of the carbide composite 180 and may be used bythe layering assembly 130 as a template to fabricate the first slice150. Similarly, a second digital cross-section 136 may define a secondslice 151 of the carbide composite 180 and may be used by the layeringassembly 130 as a template to fabricate the second slice 151.

The layering device 130 may fabricate the carbide composite 180 in oneor more portions or slices 150, 151 in a second process 175. The secondprocess 175 may include forming the slices 150, 151 using the digitalcross-sections 135, 136 as a template and binding the slices 150, 151 toone another to build the carbide composite 180. For example, thelayering device 130 may fabricate the carbide composite 180 by forming afirst slice 150 of the carbide composite 180, forming a second slice 151of the carbide composite 180, and combining or binding the first andsecond slices 150, 151 to one another to form the carbide composite 180.Any number of slices 150, 151 may be formed and/or bound to one anotherto form the carbide composite 180. For example, the number of slices150, 151 may vary from a low of about 2, about 3, about 4, about 5,about 10, or about 15 to a high of about 20, about 30, about 50, about150, about 200, about 250, about 300, about 400, about 500, or more.

Each of the slices 150, 151 may be a mono-layer slice 150, 151 or amulti-layer slice 150, 151. The layering device 130 may deposit one ormore first layers of the carbide composition having dimensionscorresponding to the first digital cross-section 135 on a substrate toform the first slice 150. The layering device 130 may deposit one ormore second or subsequent layers of the carbide composition havingdimensions corresponding to the second digital cross-section 136 on oradjacent the first layers to form the second slice 151. Any of thelayers deposited by the layering device 130 may provide or be asubstrate for any subsequent layer deposited by the layering device 130.For example, the first layer deposited by the layering device 130 mayalso be a substrate for the second layer or any subsequent layers. Thelayering device 130 may bind or fuse the first and second slices 150,151 to one another to fabricate the carbide composite 180.

To facilitate discussion of different multi-layer slices 150, 151, thefollowing notation is used herein. Each layer of a slice 150, 151 isdenoted as a different letter, such as A, B, C, D, E, etc., depending onthe number of distinct layers. When a slice 150, 151 includes more thanone layer such as more than one A layer, one or more prime symbols (′,″, ′″, etc.) are appended to the A symbol (e.g., A′, A″, etc.) toindicate layers of the same type that may be the same or may differ inone or more properties, such as carbide composition, particle size,particle shape, carbide concentration, metal binder concentration,diamond particle concentration, and/or organic binder concentration,etc., within the range of these parameters defined herein. Finally, thesymbols for adjacent layers are separated by a slash (/). Using thisnotation, a three-layer slice 150, 151 may be denoted A/B/A or A/C/A.Similarly, a five-layer slice 150, 151 of alternating layers may bedenoted A/B/A′/B′/A″. Unless otherwise indicated, the left-to-right orright-to-left order of layers is arbitrary, and the order of primesymbols; e.g., an A/B slice 150, 151 is equivalent to a B/A slice 150,151 and an A/A′/B/A″ slice 150, 151 is equivalent to an A/B/A′/A″ slice150, 151. When a multilayer slice 150, 151 has two or more of the samelayers, such as two or more B layers for example, the B layers may bethe same, or may differ in carbide composition, particle size, particleshape, carbide concentration, metal binder concentration, diamondparticle concentration, and/or organic binder concentration.

Multilayer slices 150, 151 having any of the following illustrativestructures may be used:

(a) two-layer slices 150, 151, such as A/B and B/B′;

(b) three-layer slices 150, 151, such as A/B/A′, A/A′/B, A/B/B′, B/A/B′,B/B′/B″, A/B/A, A/B/C, and A/C/A;

(c) four-layer slices 150, 151, such as A/A′/A″/B, A/A′/B/A″, A/A′/B/B′,A/B/B′/A′, B/A/A′/B′, A/B/B′/B″, B/A/B′/B″, and B/B′/B″/B′″;

(d) five-layer slices 150, 151, such as A/A′/A″/A′″/B, A/A′/A″/B/A′″,A/A′/B/A″/A′″, A/A′/A″/B/B′, A/A′/B/A″/B′, A/A′/B/B′/A″, A/B/A′/B′/A″,A/B/A′/A″/B, B/A/A′/A″/B′, A/A′/B/B′/B″, A/B/A′/B′/B″, A/B/B′/B″/A′,B/A/A′/B′/B″, B/A/B′/A′/B″, B/A/B′/B″/A′, A/B/B′/B″/B′″, B/A/B′/B″/B′″,B/B′/A/B″/B′″, B/B′/B″/B′″/B″″, and A/B/C/B/A; and similar structuresfor slices 150, 151 having six, seven, eight, nine, 10, 11, 12, 15, 20,30, 50, 150, 200, 250, 300, 400, 500, or more layers. It should beappreciated that slices 150, 151 having still more layers may be used.

The thickness of each of the layers deposited by the layering device 130is not particularly limited, but may be determined according to thedesired properties of the carbide composite 180, the properties of thecarbide composition, the layering device 130, or any combinationthereof. For example, each of the layers deposited by the layeringdevice may have a thickness from a low of about 0.0005 cm, about 0.001cm, about 0.002 cm, about 0.005 cm, or about 0.01 cm to a high of about0.03 cm, about 0.035 cm, about 0.04 cm, about 0.045 cm, about 0.05 cm,about 0.055 cm, about 0.06 cm, or more. In another example, the layersdeposited by the layering device may have a thickness from about 0.001cm to about 0.06 cm, about 0.002 to about 0.05 cm, about 0.005 to about0.04 cm, or about 0.01 to about 0.03 cm. Those skilled in the art willappreciate that the thickness of the layers for multilayer slices 150,151 may be adjusted based on desired end use performance, equipmentcapabilities, carbide composition capabilities, as well as otheradditional factors.

FIG. 3 depicts an illustrative process 300 for forming and bindingmulti-layer slices 150, 151 of the carbide composite 180, according toone or more embodiments. One or more layers 361, 362 may be depositedonto one another in a pattern or geometry corresponding to the firstdigital cross-section 135. As previously discussed, any of the one ormore layers 361, 362 may be or provide a substrate for subsequent layers361, 362. For example, a first carbide layer 361 may be deposited on asubstrate or may be the substrate for a subsequent layer, e.g. a secondcarbide layer 362. In another example, a first carbide layer 361 may bedeposited on a substrate (e.g., substrate provided by the layeringdevice 130 or another carbide layer of the carbide composite 180), and asecond carbide layer 362 may be deposited on or adjacent to the firstcarbide layer 361. The first and second carbide layers 361, 362 may bebound to one another to form the first slice 150 of the carbidecomposite 180. One or more subsequent layers 364, 365 may be depositedonto one another in a pattern or geometry corresponding to the seconddigital cross-section 135 to form the second slice 151 of the carbidecomposite. For example, a third carbide layer 364 may be deposited on oradjacent to the second carbide layer 362 or the first slice 150, and afourth carbide layer 365 may be deposited on or adjacent to the thirdcarbide layer 364. The third and fourth carbide layers 364, 365 may bebound to one another to form the second slice 151 of the carbidecomposite 180. The second slice 151 may be disposed on or adjacent tothe first slice 150.

The layers 361, 362, 364, 365 may be heated to a melting point of thecarbide composition to bind the layers 361, 362, 364, 365 to one anotherand form the slices 150, 151. For example, one or more layers 361, 362,364, 365 may include a carbide composition having a mixture of thecarbide, the metal binder, the diamond particles, and the organicbinder. The carbide composition in the layers 361, 362, 364, 365 may beheated to a melting point of the organic binder contained therein toform the first slice 150. Heating the organic binder to its meltingpoint may increase a tack of the organic binder, thereby increasing itsability to bind the carbide, the metal binder, the diamond particles, orother organic binders in the carbide composition.

The layers 361, 362, 364, 365 of the slices 150, 151 may also be boundto one another by providing one or more adhesives or coupling agents inone or more layers 361, 362, 364, 365 of the slices 150, 151. At leastone layer 361, 362, 364, 365 of the slices 150, 151 may include anadhesive or coupling agent to bind adjacent layers 361, 362, 364, 365 ofthe slices 150, 151. For example, the layering device 130 may depositthe first layer 361 of a carbide composition having the adhesive thereinand subsequently deposit the second layer 362 of a carbide compositionincluding the carbide, the metal binder, the diamond particles, or anycombination thereof on or adjacent to the first layer 361. The adhesivein the first layer 361 may bind the carbide, the metal binder, and/orthe diamond particles in the second layer 362 to form the first slice150. A subsequent layer 364 of the carbide composition including theadhesive may be deposited on or adjacent to the first slice 150, andanother layer 365 of the carbide composition including the carbide, themetal binder, the diamond particles, or any combination thereof may bedeposited on or adjacent to the layer 364 to form the second slice 151.The adhesive or coupling agents may include any of the organic bindersand/or any other suitable adhesive capable of coupling the layers 361,362, 364, 365 and/or slices 150, 151 to one another.

The slices 150, 151, whether mono-layer or multi-layer, may be heated toa melting point of the carbide composition to bind the slices 150, 151to one another to fabricate the carbide composite 180. For example, oneor more of the slices 150, 151 may include a carbide composition havinga mixture of the carbide, the metal binder, the diamond particles, theorganic binder, or any combination thereof. The slices 150, 151 may beheated to a melting point of the organic binder contained therein tobind the first slice 150 to the second slice 151. The slices 150, 151may also be bound to one another by providing an adhesive or couplingagent between the slices 150, 151. The adhesive or coupling agentcontained in the layers 361, 362, 364, 365 of the slices 150, 151 mayalso bind the slices 150, 151 to one another to fabricate the carbidecomposite 180. The adhesive or coupling agents may include any of theorganic binders and/or any other suitable adhesive capable of couplingthe layers 361, 362, 364, 365 and/or slices 150, 151 to one another.

The carbide composite 180 may be tailored for a particular downhole toolor downhole application by controlling one or more properties of thecarbide composite in the layers 361, 362, 364, 365 deposited by thelayering device 130. Illustrative properties of the carbide compositionthat may be controlled may include, but are not limited to, particleshape, particle size, and/or composition. The relative concentration ofthe carbides, the metal binders, the organic binders, and/or the diamondparticles in the carbide compositions may also be controlled to providethe carbide composite 180. For example, each of the layers 361, 362,364, 365 may have the same carbide concentration, metal binderconcentration, organic binder concentration, or diamond particleconcentration but have a different particle size. Each layer 361, 362,364, 365 may also have the same carbide concentration, metal binderconcentration, organic binder concentration, or diamond particleconcentration but have different particle shapes.

The carbide composite 180 may also be tailored for a particular downholetool or downhole application by controlling the relative concentrationof the carbides, the metal binders, the organic binders, and/or thediamond particles deposited in one or more portions (not shown) of eachindividual layer 361, 362, 364, 365. For example, a center portion (notshown) of one or more layers 361, 362, 364, 365 may have a higherconcentration of the carbides, the metal binders, the organic binders,and/or the diamond particles than an outer portion (not shown) of thelayer 361, 362, 364, 365. The center portion of the layers 361, 362,364, 365 may have a higher or lower concentration of the carbides, themetal binders, the organic binders, and/or the diamond particles and theconcentration may increase and/or decrease radially to the outer portionof the layer 361, 362, 364, 365. Similarly, the properties of thecarbide composition (e.g., particle shape, particle size, and/orcomposition) may also vary throughout one or more portions of eachindividual layer 361, 362, 364, 365. The concentration and/or theproperties of the carbide composition deposited in the one or moreportions of each individual layer 361, 362, 364, 365 may be determinedby the particular downhole tool or downhole application. For example,the concentration and/or the properties of the carbide compositiondeposited on an outer portion of the layers 361, 362, 364, 365 may bedifferent than the concentration and/or properties of the carbidecomposition deposited on an inner portion of the layers 361, 362, 364,365 to provide increased strength or toughness to the outer and/or innerportions. The concentration and/or properties of the carbide compositiondeposited in the one or more portions of each individual layer 361, 362,364, 365 may also be determined by one or more heating and/or pressingprocesses applied to the carbide composite 180. For example, theconcentration and/or the properties of the carbide composition depositedin each portion of the layers 361, 362, 364, 365 may be varied toaccount for a shrinkage of the carbide composite 180 resulting fromheating and/or pressing the carbide composite 180.

Varying the concentrations of the carbides, the metal binders, theorganic binders, the diamond particles, or any combination thereof inthe carbide composition in the layers 361, 362, 364, 365 and/or theslices 150, 151 may determine, at least in part, the strength, hardness,toughness, and/or the wear resistance of the carbide composite 180. Forexample, increasing the concentration of the metal binder may increasethe fracture toughness and/or decrease the wear resistance of thecarbide composite 180. The concentration of the carbide, the metalbinder, the diamond particles, and/or the organic binder deposited bythe layering device 130 may also increase and/or decrease a density ofthe carbide composite 180.

The carbide compositions deposited in the layers 361, 362, 364, 365 bythe layering device 130 may be or include a mixture of one or morecarbides, metal binders, diamond particles, and/or organic binders. Theconcentration of the carbides may be from a low of about 5 wt %, about10 wt %, about 15 wt %, about 20 wt %, about 25 wt %, about 30 wt %,about 40 wt %, or about 50 wt % to a high of about 50 wt %, about 60 wt%, about 70 wt %, about 80 wt %, about 90 wt %, about 95 wt %, or more,based on the combined weight of the carbides, diamond particles, themetal binders, and/or the organic binders. For example, carbidecompositions that include a mixture of the carbides, the metal binders,diamond particles, and/or the organic binders may have a carbideconcentration from about 5 wt % to about 95 wt %, about 15 wt % to about90 wt %, about 20 wt % to about 80 wt %, about 25 wt % to about 70 wt %,or about 50 wt % to about 60 wt %, based on the combined weight of thecarbides, the metal binders, diamond particles, and/or the organicbinders.

The concentration of the metal binders deposited in the layers 361, 362,364, 365 by the layering device 130 may be from a low of about 5 wt %,about 10 wt %, about 15 wt %, about 20 wt %, about 25 wt %, about 30 wt%, about 40 wt %, or about 50 wt % to a high of about 50 wt %, about 60wt %, about 70 wt %, about 80 wt %, about 90 wt %, about 95 wt %, ormore, based on the combined weight of the carbides, the metal binders,diamond particles, and/or the organic binders. For example, carbidecompositions that include a mixture of the carbides, the metal binders,diamond particles, and/or the organic binders may have a metal binderconcentration from about 5 wt % to about 95 wt %, about 15 wt % to about90 wt %, about 20 wt % to about 80 wt %, about 25 wt % to about 70 wt %,or about 50 wt % to about 60 wt %, based on the combined weight of thecarbides, the metal binders, diamond particles, and/or the organicbinders.

The organic binder may be provided in a concentration suitable forenhancing the binding of the carbides, the metal binders, the diamondparticles, and/or the organic binders in the carbide composition. Theorganic binder may also be provided in a concentration suitable forbinding the layers 361, 362, 364, 365 to one another to form the slices150, 151. The organic binder may also be provided in a concentrationsuitable for binding the slices 150, 151 to one another to build thecarbide composite 180. For example, the organic binder may be providedas an adhesive or coupling agent to securely bind the carbides, themetal binders, the diamond particles, and/or the organic binders in thelayers 361, 362, 364, 365 and/or between adjacent layers 361, 362, 364,365.

Similarly, the organic binder may be provided as an adhesive or couplingagent to securely bind the slices 150, 151 to one another to build thecarbide composite 180. The organic binder may also be provided in aconcentration suitable to provide sufficient hardness and/or toughnessto the carbide composite 180. The organic binder may also be provided ina concentration suitable for promoting the flow of the carbidecomposition in the layering device 130. For example, the organic bindermay be provided in a concentration that facilitates the flow of thecarbide composition through a nozzle or printer head (not shown) of thelayering device 130 during one or more deposition processes.

The concentration of the organic binders may be from a low of about 0.5wt %, about 0.8 wt %, about 1 wt %, about 1.2 wt %, about 1.5 wt %,about 1.8 wt %, about 2 wt %, about 2.2 wt %, about 2.5 wt %, about 2.8wt %, about 3 wt %, about 3.2 wt %, about 3.5 wt %, or about 3.8 wt %,about 4 wt %, about 5 wt %, about 8 wt %, about 10 wt %, about 15 wt %,about 20 wt %, about 25 wt %, or about 30 wt % to a high of about 35 wt%, about 40 wt %, about 50 wt %, about 60 wt %, about 70 wt %, about 80wt %, about 90 wt %, about 95 wt %, or more, based on the combinedweight of the carbides, the metal binders, diamond particles, and/or theorganic binders. For example, carbide compositions that include amixture of the carbides, the metal binders, diamond particles, and/orthe organic binders may have an organic binder concentration from about0.5 wt % to about 5 wt %, about 0.8 wt % to about 4 wt %, about 1 wt %to about 3.8 wt %, about 1.2 wt % to about 3.5 wt %, or about 1.5 wt %to about 3.2 wt %, based on the combined weight of the carbides, themetal binders, diamond particles, and/or the organic binders.

The concentration of the diamond particles may be from a low of about0.5 wt %, about 0.8 wt %, about 1 wt %, about 1.2 wt %, about 1.5 wt %,about 1.8 wt %, about 2 wt %, about 2.2 wt %, about 2.5 wt %, about 2.8wt %, about 3 wt %, about 3.2 wt %, about 3.5 wt %, or about 3.8 wt %,about 4 wt %, about 5 wt %, about 8 wt %, about 10 wt %, about 15 wt %,about 20 wt %, about 25 wt %, or about 30 wt % to a high of about 35 wt%, about 40 wt %, about 50 wt %, about 60 wt %, about 70 wt %, about 80wt %, about 90 wt %, about 95 wt %, or more, based on the combinedweight of the carbides, the metal binders, the organic binders, and/orthe diamond particles. For example, carbide compositions that include amixture of the carbides, the metal binders, and/or the organic bindersmay have a diamond particle concentration from about 5 wt % to about 95wt %, about 15 wt % to about 90 wt %, about 20 wt % to about 80 wt %,about 25 wt % to about 70 wt %, or about 50 wt % to about 60 wt %, basedon the combined weight of the carbides, the metal binders, the organicbinders, and/or the diamond particles.

The particle shapes and/or sizes of the carbide compositions may becontrolled by subjecting the carbide compositions to one or moreprocesses. The carbide compositions may also be mixed, combined, orotherwise agglomerated to provide carbide compositions having a mixtureof the carbides, the metal binders, the organic binders, and/or thediamond particles. The shaping or sizing of the particles in the carbidecompositions and the mixing or agglomeration of the carbide compositionsmay be performed simultaneously in one or more processes. Illustrativeshaping, sizing, mixing, and/or agglomeration processes may include, butare not limited to, milling, granulation, or any combination thereof.

The carbide composition may be milled to mix the carbides, the metalbinders, the organic binders, and/or the diamond particles containedtherein. The carbide composition may also be milled to coat or embed thecarbides, the metal binders, the organic binders, and/or the diamondparticles with the metal binders and/or the organic binders. Forexample, a carbide composition having a mixture of the carbides and themetal binders may be milled to coat the carbides with the metal binders,thereby providing a carbide composition having carbides coated with analkali metal, a transition metal, or any mixture or alloy thereof. Thecarbide composition having a mixture of the carbides, the metal binders,the organic binders, and/or the diamond particles may also be milled tocoat or embed the carbides, the metal binders, the organic binders,and/or the diamond particles within the organic binders containedtherein. The carbide composition may also be milled to reduce theparticle size of the carbides, the metal binders, the organic binders,and/or the diamond particles contained therein to provide fine particlesof the carbide composition. The carbide composition may also be milledto shape the particles therein to provide particles having irregularand/or angular shapes. The size and/or shape of the particles may bedetermined, at least in part, by the amount or time in which the carbidecompositions are subjected to the milling processes. Illustrativemilling processes may include, but are not limited to, milling withmilling media (e.g., ball milling and attritor milling), milling with acolloid mill, wet milling, or any combination thereof.

The milled carbide compositions may have an average particle size from alow of about 0.1 micron (μm), about 0.2 μm, about 0.3 μm, about 0.4 μm,about 0.5 μm, about 0.6 μm, about 0.7 μm, about 0.8 μm, about 0.9 μm,about 1 micron (μm), about 2 μm, about 3 μm, about 5 μm, about 10 μm,about 15 μm, about 20 μm, about 30 μm, about 40 μm, about 50 μm, about60 μm, about 70 μm, about 80 μm, about 90 μm, about 180 μm, or about 150μm to a high of about 160 μm, about 170 μm, about 180 μm, about 190 μm,about 200 μm, about 210 μm, about 220 μm, about 230 μm, about 240 μm,about 250 μm, or more. The milled carbide compositions may also have anaverage particle size from about 0.1 μm to about 250 μm, about 2 μm toabout 200 μm, about 5 μm to about 190, about 10 μm to about 180, about15 μm to about 170, about 20 μm to about 160, about 0.5 μm to about 1μm, about 0.1 μm to about 1 μm, about 0.5 μm to about 10 μm, or about 50μm to about 150 μm.

The carbide composition may be granulated to provide particles having auniform shape, size, concentration, or any combination thereof.Granulation may include a process of forming or crystallizing thecarbide composition into grains. Granulation may be utilized to preventthe segregation of one or more components of the carbide composition.For example, segregation may cause higher density components to separatefrom lower density components. Accordingly, granulating the carbidecomposite may provide a mixture where each of the components of thecarbide composite have a uniform concentration throughout. Granulationmay also improve compaction of the carbide composition by providing amore uniform distribution of one or more binders throughout theparticles of the carbide composition. Granulation may provide particleswith improved flow properties. For example, the carbide composition mayinclude irregular shapes and/or surface characteristics beforegranulation that result in cohesion of the particles to one another.Granulation of the particles of the carbide composition may providelarger more isodiametric particles, which may improve flow properties ofthe carbide composition. The milled carbide composition may also begranulated to provide particles having a uniform shape, size,concentration, or any combination thereof. For example, granulating themilled carbide composition containing a mixture of the carbides, themetal binders, the diamond particles, and/or the organic binders mayprovide spherical or rounded shaped bodies having similar concentrationsand/or compositions of the carbides, the metal binders, the diamondparticles, and/or the organic binders. The carbide composition may begranulated to increase the apparent density of the carbide composition.For example, the granulated carbide composition may have an increasedapparent density as compared to the milled carbide composition.Illustrative granulation processes may include, but are not limited to,freeze granulation, sieve granulation, spray drying, or any combinationthereof.

The granulated carbide composition may have an average particle sizegreater than the particle size of the carbides, the metal binders, theorganic binders, and/or the diamond particles. For example, the averageparticle size of the granulated carbide composition may be greater thanthe carbides, the metal binders, the organic binders, and/or the diamondparticles by two to three orders of magnitude. The granulated carbidecompositions may have an average particle size from a low of about 1micron (μm), about 2 μm, about 3 μm, about 5 μm, about 10 μm, about 15μm, about 20 μm, about 30 μm, about 40 μm, about 50 μm, about 60 μm,about 70 μm, about 80 μm, about 90 μm, about 180 μm, or about 150 μm toa high of about 160 μm, about 170 μm, about 180 μm, about 190 μm, about200 μm, about 210 μm, about 220 μm, about 230 μm, about 240 μm, about250 μm, or more. The granulated carbide compositions may also have anaverage particle size from about 1 μm to about 250 μm, about 2 μm toabout 200 μm, about 5 μm to about 190, about 10 μm to about 180, about15 μm to about 170, about 20 μm to about 160, or about 50 μm to about150 μm. In another example, the granulated carbide composition may havean average particle size from a low of about 200 μm, about 300 μm, about400 μm, about 500 μm, about 600 μm, about 700 μm, about 800 μm, about900 μm, or about 1 μm to a high of about 3 mm, about 3.1 mm, about 3.2mm, about 3.3 mm, about 3.4 mm, about 3.5 mm, about 3.6 mm, about 3.7mm, about 3.8 mm, about 3.9 mm, about 4.0 mm, or more. The granulatedcarbide composition may also have an average particle size from about200 μm to about 4.0 mm, about 300 μm to about 3.9 mm, about 400 μm toabout 3.8 mm, about 500 μm to about 3.7 mm, about 600 μm to about 3.6mm, about 700 μm to about 3.5 mm, about 800 μm to about 3.4 mm, about900 μm to about 3.3 mm, or about 1 mm to about 3.2 mm.

In operation, the layering device 130 may deposit the milled and/orgranulated carbide compositions in one or more layers 361, 362 on asubstrate or base and subsequently bind the layers 361, 362 to form thefirst slice 150. The layering device 130 may bind the layers 361, 362 byany suitable method to form the slices 150, 151 of the carbide composite180. For example, the layering device 130 may include a laser (notshown) capable of heating the carbide compositions to the melting pointof the organic binder contained therein. As noted above, heating theorganic binder may increase the tack of the organic binder, therebyresulting in the bonding of the carbides, the metal binders, and/or thediamond particles contained in the milled and/or granulated carbidecompositions. The laser of the layering device 130 may use the firstdigital cross-section 135 as a template to bind the layers 361, 362 toform the first slice 150. For example, the laser may trace across-sectional area corresponding to the cross-sectional area of thefirst digital cross-section 135 on the layers 361, 362 of the carbidecomposition to form the first slice 150. The layering device 130 maythen deposit subsequent layers 364, 365 of the milled and/or granulatedcarbide compositions on or adjacent to the first slice 150. The lasermay then trace a cross-sectional area corresponding to thecross-sectional area of the second digital cross-section 136 on thesubsequent layers 364, 365 to form the second slice 151. The laser mayalso be capable of heating the layers 361, 362, 364, 365 to atemperature sufficient to sinter the carbide composition.

The layering device 130 may also deposit the layers 361, 362 of themilled and/or granulated carbide composition in a precise shape orgeometry corresponding to the first digital cross-section 135 of thecarbide composite 180. The layers 361, 362 of the milled and/orgranulated carbide compositions may then be heated to bind the carbidecomposition and form the first slice 150. The process may then berepeated until the carbide composite 180 is constructed.

As previously discussed, each of the slices 150, 151 may include two ormore layers 361, 362, 364, 365 of the carbide composition. Each of thelayers 361, 362, 364, 365 of the multi-layer slices 150, 151 may includethe carbides, the metal binders, the organic binders, or any mixture orcombination thereof. In at least one embodiment, the first layer 361 mayinclude the carbide, the metal binder, or any combination or mixturethereof, and the second layer 362 may include the organic binder. Thesecond layer 362 including the organic binder may facilitate the bindingof the carbides and/or the metal binders in the first layer 361. Thesecond layer 362 may also enhance the binding between adjacent slices150, 151 deposited by the layering device 130. For example, the layeringdevice 130 may form the slices 150, 151 by first depositing the carbide,the metal binder, or any mixture or combination thereof in the firstlayer 361. The layering device 130 may then deposit the organic binderin the second layer 362 and subsequently heat the second layer 362 tobind the carbide and/or the metal binder in the first layer 361, therebyforming the first fused slice 150. The organic binder in the secondlayer 362 may also be provided to bind adjacent slices 150, 151 of thecarbide composite 180.

One or more properties of the carbide composite 180 fabricated by thelayering device 130 may also depend, at least in part, on one or moreoperating parameters of the layering device 130. For example, the rateat which the layering device 130 deposits the carbide composition mayincrease and/or decrease the density of the carbide composite 180. Therate and temperature of heating and/or binding the layers 361, 362, 364,365 or slices 150, 151 may also increase and/or decrease the density ofthe carbide composite 180.

The density of the carbide composite 180 may also depend, at least inpart, on the particle shape, particle size, and/or concentration of thecarbide composition deposited by the layering device 130. For example,the density of the carbide composite 180 may be increase and/ordecreased by depositing a milled carbide composition as compared to agranulated carbide composition.

The carbide composite 180 fabricated by the layering device 130 via 3Dprinting may have a density from a low of about 60%, about 65%, or about70% to a high of about 75%, about 80%, about 85%, about 90%, or morebased on a theoretical density of the carbide compositions containedtherein. For example, the carbide composite 180 may have a density fromabout 60% to about 90%, about 65% to about 85%, or about 70% to about80%. The theoretical density may be the calculated density of thecarbide compositions based on the atomic weight and the crystalstructure thereof.

The carbide composite 180 fabricated by the layering device 130 via 3Dprinting may have a toughness, K_(IC) (MPa·m^(1/2)), from a low of about0.5 MPa·m^(1/2), about 1 MPa·m^(1/2), about 2 MPa·m^(1/2), about 3MPa·m^(1/2), or about 4 MPa·m^(1/2) to a high of about 5 MPa·m^(1/2),about 6 MPa·m^(1/2), about 7 MPa·m^(1/2), about 8 MPa·m^(1/2), about 9MPa·m^(1/2), about 10 MPa·m^(1/2), about 15 MPa·m^(1/2), or more. Forexample, the toughness, K_(IC) (MPa·m^(1/2)), of the carbide composite180 may be from about 1 MPa·m^(1/2) to about 15 MPa·m^(1/2), about 2MPa·m^(1/2) to about 10 MPa·m^(1/2), about 3 MPa·m^(1/2) to about 9MPa·m^(1/2), or about 4 MPa·m^(1/2) to about 8 MPa·m^(1/2).

The carbide composites 180 fabricated by the layering device 130 via 3Dprinting may have a strength (MPa) from a low of about 500 MPa, about600 MPa, about 700 MPa, about 800 MPa, or about 900 MPa to a high ofabout 1000 MPa, about 1100 MPa, about 1200 MPa, about 1300 MPa, about1400 MPa, about 1500 MPa, about 1600 MPa, or more. For example, thestrength (MPa) of the carbide composite 180 may be from about 500 MPa toabout 1600 MPa, about 600 MPa to about 1500 MPa, about 700 MPa to about1400 MPa, or about 800 MPa to about 1300 MPa.

The carbide composite 180 fabricated by the layering device 130 via 3Dprinting may have a hardness or a Vickers hardness (kg/mm²) from a lowof about 500 kg/mm², about 800 kg/mm², about 1000 kg/mm², about 1200kg/mm², or about 1300 kg/mm² to a high of about 1400 kg/mm², about 1500kg/mm², about 1600 kg/mm², about 1700 kg/mm², about 1800 kg/mm², about1900 kg/mm², about 2000 kg/mm², or more. For example, the hardness(kg/mm²) of the carbide composite 180 may be from about 500 kg/mm² toabout 2000 kg/mm², about 800 kg/mm² to about 1900 kg/mm², about 1000kg/mm² to about 1700 kg/mm², or about 1200 kg/mm² to about 1500 kg/mm².

The carbide composite 180 fabricated by the layering device 130 via 3Dprinting may have also have a Rockwell A Scale hardness (HRA) from a lowof about 30 HRA, about 40 HRA, about 45 HRA, about 50 HRA, or about 55HRA to a high of about 60 HRA, about 65 HRA, about 70 HRA, about 75 HRA,about 80 HRA, about 90 HRA, about 100 HRA, or more. For example, theRockwell A Scale hardness (HRA) of the carbide composite 180 may be fromabout 30 HRA to about 100 HRA, about 40 HRA to about 80 HRA, about 45HRA to about 65 HRA, or about 50 HRA to about 60 HRA.

The carbide composite 180 fabricated by the layering device 130 may beprocessed by any suitable method known in the art. The processing of thecarbide composite 180 may include one or more heating and/or pressingprocesses. For example, the carbide composite 180 may be subjected toone or more pre-sintering processes to remove the organic binderscontained therein. Pre-sintering may include heating the carbidecomposite 180 under vacuum from a low of about 500° C., about 600° C.,about 700° C., about 800° C., about 850° C., about 900° C., about 1000°C. to a high of about 1100° C., about 1150° C., about 1200° C., about1250° C., about 1300° C., about 1400° C., or more. For example,pre-sintering may include heating the carbide composite 180 from about500° C. to about 1400° C., about 600° C. to about 1300° C., about 700°C. to about 1200° C., about 800° C. to about 1100° C., or about 850° C.to about 1000° C.

The carbide composite 180 may also be subjected to one or more heatingand pressing processes to provide a cemented carbide composite. Forexample, the carbide composite 180 may be heated and pressed in asintering process to provide the cemented carbide composite. Sinteringthe carbide composite 180 may cause the metal binder to melt and bindwith the carbides to provide a metal matrix where the metal binder actsas a matrix material and the carbides act as an aggregate material inthe metal matrix. Sintering may increase the density, strength,toughness, and/or the hardness of the carbide composite 180.Illustrative sintering processes may include, but are not limited to,vacuum sintering, hot isostatic pressing (HIP), or any combinationthereof. HIP may be performed in a gaseous (e.g., inert argon or helium)atmosphere contained within a pressure vessel. The gaseous atmosphere aswell as the carbide composite 180 to be pressed are heated by a furnacewithin the vessel.

Sintering may include heating the carbide composite 180 from a low ofabout 1000° C., about 1100° C., about 1200° C., about 1300° C., about1400° C., about 1500° C. to a high of about 1600° C., about 1700° C.,about 1800° C., about 1900° C., about 2000° C., or more. For example,sintering may include heating the carbide composite 180 from about 1000°C. to about 2000° C., about 1100° C. to about 1900° C., about 1200° C.to about 1800° C., about 1300° C. to about 1700° C., or about 1400° C.to about 1600° C.

The sintered carbide composite 180 fabricated by the layering device 130via 3D printing may have a density from a low of about 80%, about 85%,or about 90% to a high of about 95%, about 95%, about 99%, about 99.5%,or more based on a theoretical density of the carbide compositionscontained therein. For example, the carbide composite 180 may have adensity from about 80% to about 99.5%, about 85% to about 99%, or about90% to about 95%. The sintered carbide composite 180 may also have adensity from a low of about 90%, about 91%, about 92%, about 93%, about94%, or about 95% to a high of about 96%, about 97%, about 98%, about99%, about 99.5%, or more.

The sintered carbide composite 180 fabricated by the layering device 130via 3D printing may have a toughness, K_(IC) (MPa·m^(1/2)) from a low ofabout 1.5 MPa·m^(1/2), about 2 MPa·m^(1/2), about 3 MPa·m^(1/2), about 4MPa·m^(1/2), or about 5 MPa·m^(1/2) to a high of about 6 MPa·m^(1/2),about 7 MPa·m^(1/2), about 8 MPa·m^(1/2), about 9 MPa·m^(1/2), about 10MPa·m^(1/2), about 15 MPa·m^(1/2), about 25 MPa·m^(1/2), or more. Forexample, the toughness, K_(IC) (MPa·m^(1/2)), of the carbide composite180 may be from about 1 MPa·m^(1/2) to about 50 MPa·m^(1/2), about 2MPa·m^(1/2) to about 30 MPa·m^(1/2), about 3 MPa·m^(1/2) to about 20MPa·m^(1/2), or about 15 MPa·m^(1/2) to about 10 MPa·m^(1/2).

The sintered carbide composite 180 fabricated by the layering device 130via 3D printing may have a strength (MPa) from a low of about 1000 MPa,about 1100 MPa, about 1200 MPa, about 1300 MPa, or about 1400 MPa to ahigh of about 1500 MPa, about 1600 MPa, about 1700 MPa, about 1800 MPa,about 1900 MPa, about 2000 MPa, about 2500 MPa, about 3000 MPa, or more.For example, the strength (MPa) of the carbide composite 180 may be fromabout 1000 MPa to about 3000 MPa, about 1200 MPa to about 2500 MPa,about 1300 MPa to about 2500 MPa, or about 1400 MPa to about 1800 MPa.

The sintered carbide composite 180 fabricated by the layering device 130via 3D printing may have a hardness or a Vickers hardness (kg/mm²) froma low of about 1000 kg/mm², about 1100 kg/mm², about 1200 kg/mm², about1300 kg/mm², or about 1400 kg/mm² to a high of about 1600 kg/mm², about1700 kg/mm², about 1800 kg/mm², about 1900 kg/mm², about 2000 kg/mm²,about 2100 kg/mm², about 2500 kg/mm², about 3000 kg/mm², or more. Forexample, the hardness (kg/mm²) of the carbide composite 180 may be fromabout 1000 kg/mm² to about 3000 kg/mm², about 2500 kg/mm² to about 2100kg/mm², about 1300 kg/mm² to about 2000 kg/mm², or about 1400 kg/mm² toabout 1800 kg/mm².

The sintered carbide composite 180 fabricated by the layering device 130via 3D printing may have also have a Rockwell A Scale hardness (HRA)from a low of about 50 HRA, about 60 HRA, about 65 HRA, about 70 HRA, orabout 75 HRA to a high of about 80 HRA, about 85 HRA, about 90 HRA,about 95 HRA, about 100 HRA, about 110 HRA, about 120 HRA, or more. Forexample, the Rockwell A Scale hardness (HRA) of the carbide composite180 may be from about 50 HRA to about 120 HRA, about 60 HRA to about 100HRA, about 65 HRA to about 85 HRA, or about 70 HRA to about 80 HRA.

The carbide composites 180 may be used in and/or on one or more downholetools. The downhole tools for which the carbide composites 180 may befabricated may include well drilling equipment, well drilling tools,well completion equipment, well completion tools, and/or associatedcomponents thereof. Illustrative downhole tools may include, but are notlimited to, rotors, stators, and/or housings for downhole drillingmotors, blades and/or housings for downhole turbines, cones for rollercone drill bits, drill bits or bit heads, bearings, and other downholetools having complex configurations and/or asymmetric geometriesrequiring a cemented carbide composite 180.

The carbide composite 180 may be an insert and/or cutting element for adownhole tool (e.g., drill bit). FIG. 4 depicts a side view of anillustrative downhole tool 400 including inserts 410, 420 fabricated via3D printing, according to one or more embodiments. The inserts 410, 420may include polycrystalline diamond (PCD) inserts, tungsten carbideinserts, tungsten carbide inserts having a super-abrasive surface, suchas natural or synthetic diamond, polycrystalline diamond,polycrystalline cubic boron nitride (PCBN), or inserts constructed of amatrix of tungsten carbide and other materials, or any combinationthereof. The inserts 410, 420 may be fabricated by providing the carbidecomposite as a substrate and subsequently providing one or more layersof PCD and/or PCBN to the carbide composite substrate to provide theinserts 410, 420. For example, a carbide composite 180 may be fabricatedas a substrate and layers of PCD and/or PCBN may be subsequentlydeposited by the layering device 130 to provide the insert 410, 420. Theinserts 410, 420 may have any shape suitable for the downhole tool 400.For example, the inserts 410, 420 may have a cylindrical shape with asemi-round top, a conical top, or a frustoconical top. The inserts 410,420 may include one or more PCD and/or PCBN layers. Illustrativedownhole tools 400 for which the inserts 410, 420 may be utilized mayinclude, but are not limited to, a blade, a drill bit, a section mill,an underreamer, a stabilizer, a friction brake, a sensor, a pipe cutter,a fishing tool, or any other downhole tool 400 subjected to wear indownhole operations.

Polycrystalline diamond may include a plurality of diamond grainsdirectly bonded together via diamond-to-diamond bonding to define aplurality of interstitial regions. A portion of the interstitial regionsmay be occupied by a metal catalyst. The metal catalyst may include oneor more of the metal binders previously discussed (e.g., iron, nickel,cobalt, or alloys thereof). The layering device 130 may fabricate thecarbide composite 180 with a carbide composition including a mixture ofthe carbide (e.g. WC), the metal binder (e.g., Co), the organic binder,and/or the diamond particles. The first slice 150 of the carbidecomposite 180 may include a carbide composition including the carbide(e.g., WC) and the metal binder (e.g., Co), and the second slice 151 ofthe carbide composite 180 may include the diamond particles. The carbidecomposite 180 may be subjected to one or more heating and/or pressingprocesses (e.g., sintering) to provide the PCD inserts 410, 420.

Although only a few embodiments have been described in detail above,those skilled in the an will readily appreciate that many modificationsare possible in the embodiments without materially departing from thepresent disclosure. Accordingly, all such modifications are intended tobe included within the scope of this disclosure. In the claims,means-plus-function clauses are intended to cover the structuresdescribed herein as performing the recited function and not onlystructural equivalents, but also equivalent structures. Thus, although anail and a screw may not be structural equivalents in that a nailemploys a cylindrical surface to secure wooden parts together, whereas ascrew employs a helical surface, in the environment of fastening woodenparts, a nail and a screw may be equivalent structures. It is theexpress intention of the applicant not to invoke 35 U.S.C. §112,paragraph 6 for any limitations of any of the claims herein, except forthose in which the claim expressly uses the words ‘means for’ togetherwith an associated function.

Certain embodiments and features have been described using a set ofnumerical upper limits and a set of numerical lower limits. It should beappreciated that ranges including the combination of any two values,e.g., the combination of any lower value with any upper value, thecombination of any two lower values, and/or the combination of any twoupper values are contemplated unless otherwise indicated. Certain lowerlimits, upper limits and ranges may appear in one or more claims below.All numerical values are “about” or “approximately” the indicated value,and take into account experimental error and variations that would beexpected by a person having ordinary skill in the art.

Various terms have been defined above. To the extent a term used in aclaim is not defined above, it should be given the broadest definitionpersons in the pertinent art have given that term as reflected in atleast one printed publication or issued patent. Furthermore, allpatents, test procedures, and other documents cited in this applicationare fully incorporated by reference to the extent such disclosure is notinconsistent with this application and for all jurisdictions in whichsuch incorporation is permitted.

What is claimed is:
 1. A method for fabricating a carbide composite fora downhole tool, comprising: depositing a first layer on a substrate,the first layer comprising one or more first carbides, the first layerbeing from about 0.0005 cm to about 0.06 cm thick; depositing a secondlayer at least partially adjacent the first layer, the second layercomprising one or more second carbides, metal binders, organic binders,or a combination thereof, the second layer being from about 0.0005 cm toabout 0.06 cm thick, and wherein the first and second layers have adifferent particle size, particle shape, carbide concentration, metalbinder concentration, or organic binder concentration from one another;and binding the first and second layers to form the carbide composite,wherein the first and second layers are formed by additive manufacturingusing a CAD assembly.
 2. The method of claim 1, further comprisingheating and pressing the carbide composite.
 3. The method of claim 2,wherein at least one of the first or second layers comprises diamondparticles, and wherein heating and pressing the carbide compositeprovides a polycrystalline diamond insert for the downhole tool.
 4. Themethod of claim 1, wherein the first and second carbides areindividually selected from the group consisting of titanium carbide,vanadium carbide, chromium carbide, zirconium carbide, niobium carbide,molybdenum carbide, hafnium carbide, tantalum carbide, tungsten carbide,and combinations thereof.
 5. The method of claim 1, wherein the metalbinders are selected from the group consisting of ruthenium, osmium,iron, cobalt, and combinations thereof.
 6. The method of claim 1,wherein the metal binders are selected from the group consisting oflithium, sodium, potassium, rubidium, cesium, and combinations thereof.7. The method of claim 1, wherein the organic binders are selected fromthe group consisting of polyolefins, polyol ether-esters, chlorinatednaphthalenes, hydrocarbon waxes, and combinations thereof.
 8. The methodof claim 1, further comprising milling one or more components of thefirst or second layers before depositing the first and second layers. 9.The method of claim 8, wherein milling coats the first carbide with asecond organic binder or the second carbide with the organic binder. 10.The method of claim 1, further comprising granulating the components ofthe first or second layers before depositing the first and second layersto facilitate flow of the components.
 11. The method of claim 1, whereinbinding the first and second layers forms the carbide composite having adensity from about 75% to about 85% based on a theoretical density ofthe carbide composite.
 12. The method of claim 1, further comprisingpre-sintering the carbide composite to remove at least a portion of theorganic binder contained therein.
 13. A method for fabricating a carbidecomposite for a downhole tool, comprising: depositing a carbide layer ona substrate, the carbide layer comprising tungsten carbide and cobalt,the carbide layer being from about 0.0005 cm to about 0.06 cm thick;depositing a second layer at least partially on the carbide layer, thesecond layer comprising one or more carbides, metal binders, organicbinders, diamond particles, or a combination thereof, the second layerbeing from about 0.0005 cm to about 0.06 cm thick, and wherein thecarbide layer and the second layer have a different particle size,particle shape, carbide concentration, metal binder concentration,diamond particle concentration, or organic binder concentration from oneanother; binding the carbide layer and second layers to form the carbidecomposite; and sintering the carbide composite to form a polycrystallinediamond insert, wherein the carbide layer and the second layer areformed by additive manufacturing using a CAD assembly.
 14. The method ofclaim 13, wherein sintering the carbide composite comprises heating andpressing the carbide composite.
 15. The method of claim 13, wherein thesecond layer comprises a carbide selected from the group consisting oftitanium carbide, vanadium carbide, chromium carbide, zirconium carbide,niobium carbide, molybdenum carbide, hafnium carbide, tantalum carbide,tungsten carbide, and combinations thereof.
 16. The method of claim 13,wherein the second layer comprises a metal binder selected from thegroup consisting of magnesium, ruthenium, osmium, iron, cobalt, nickel,copper, molybdenum, tantalum, tungsten, rhenium, and combinationsthereof.
 17. The method of claim 13, wherein sintering the carbidecomposite comprises vacuum sintering the carbide composite or hotisostatic pressing the carbide composite.
 18. The method of claim 1,wherein the CAD assembly includes a digital design.
 19. The method ofclaim 18, wherein a layering device uses the digital design as atemplate to form the carbide composite.
 20. The method of claim 13,wherein the CAD assembly includes a digital design.